This like many of SDC's business areas is based on several Small Business Innovative Research (SBIR) and other contracts. SDC's primary interest related to electronic enclosures is for space and or missile applications, which have a unique set of multi-functional requirements, and can benefit most from the lighter weight, lower density composite materials. Current contracts to develop a multifunctional electronic enclosure have the potential for achieving a very high Technology Readiness Level (TRL) in a flight test, the manufacturing cost and material database generated in this program will have substantial leverage to many space and air vehicle applications

It is no secret that power and heat concentration requirements are both increasing at a fast rate, which ultimately will make thermal management enabling technology. Thermal management technologies at SDC, again being developed on SBIR funding, encompass both heat sink and heat transport capabilities. These programs are developing a variety of technologies for spreading heat under very high heat flux chips, transporting heat effectively to heat sinks, and lightweight heat sinks that can be operated continuously in ground tests prior to final installation in flight tests.

In a recently completed Phase II SBIR, SDC and Auburn University research personnel for the first time demonstrated a liquid metal micro-heat pipe operation in a very high heat flux environment. The array of 22 micro-channels, subjected to a heat flux of 400 Watts/mm2, operated in a linear fashion. This demonstration was only limited by the magnitude of heat flux that could be applied. Theoretically, the limits for this type of system is substantially greater.